TTTC's Electronic Broadcasting Service
TTTC's Electronic Broadcasting Service

23rd IEEE European Test Symposium
(ETS'18)
May 28 – June 01, 2018
Swisshotel Bremen (Bremen, Germany)

www.ets18.de

CALL FOR PAPERS

Scope

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applicatioons, hot topics, and new trends in the area of electronic-based circuit and system testing and reliability.

In 2018, ETS will take place at Swissôtel, Bremen, Germany. It is organized by the University of Bremen, which co-sponsors the event jointly with the IEEE Council on Electronic Design Automa on (CEDA). ETS traditionally enjoys a strong balance among academic and industrial participants. In addition to regular Scientific Papers, Special Sessions, Panels, and Embedded Tutorials, ETS features Vendor Sessions and Table-Top Demos as well as a special track on Emerging Test Strategies (ETS2) where new issues are presented by the industry and are discussed in an informal atmosphere. ETS is the major event of the European Test Week, which includes TSS (Test Spring School) and fringe workshops.

You are invited to participate and submit your contributions to ETS’18. The following topic chairs have been selected to put particular emphasis on their topic:

P. Bernardi: Microprocessor and On-line Test, K. Chakrabarty: Emerging Technologies in Test, P. Girard: Power Issues in Test, S. Hamdioui: Memory and Nanotechnology Test, E. Larsson: Test Architectures and Standards, G. Léger: Analog/Mixed Signal Test, M. Maniatakos: Security and Trust Issues in Test, I. Polian: Test Generation and Reliability, J. Rivoir: Automatic Test Equipment and Yield, C. Scholl: Validation and Verification, A. Singh: Defect-based Test and Variability.

In summary, areas of interest include (but are not limited to):

  • Analog Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DfT)
  • Design for Manufacturing (DfM)
  • Diagnosis and Silicon Debug
  • Economics of Test
  • Test of Emerging Technologies
  • Failure Analysis
  • Fault Injection
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • Hardware Trojans
  • Hardware and IP Security Test and Verification
  • High-Speed I/O Test
  • Low-Power IC Test
  • Memory Test and Repair
  • MEMS Test
  • Microprocessor Test
  • Mixed-Signal Test
  • Multi-/Many-core Processor Test
  • Nanotechnology Test
  • On-line Test
  • Power Issues in Test
  • Reconfigurable System Test
  • Reliability
  • Reliability-Security Trade-offs
  • RF Test
  • Security and Trust Issues in Test
  • Self-Repair
  • Sensor Test
  • Side-channels Analysis
  • Signal Integrity Test
  • SiP, Stacked, 3D IC Test
  • SoC Test
  • Soft  Errors
  • Standards in Test
  • Statistical Learning in Test
  • Test Compression
  • Test Quality
  • Test Synthesis
  • Thermal Issues in Test
  • Validation and Verification
  • Variability Issues in Test
  • Yield Analysis and Enhancement

 

 

Submissions

Publication – ETS‘18 will produce electronic formal proceedings with ISBN number to be indexed in the IEEE Xplore Digital Library and other bibliographical search engines.

Submissions – ETS’18 seeks:

Scientific Papers for the Formal Proceedings, presenting novel, unpublished, and complete research work. Prospective authors should be aware that ETS’18 fully complies with the IEEE publication policies regarding multiple submissions, plagiarism, etc.

ETS’18 also seeks proposals for:

  • Special Sessions, Panels, and Embedded Tutorials.
  • Special Session contributions to the special track on Emerging Test Strategies (ETS2).
  • Vendor and Table-Top Demos presentations focusing on new features of test related products.
  • Fringe Workshops, to be held during May 31 - June 01, 2018.
  • Fringe Meetings, to be held during the European Test Week.

Key dates regarding the submission of proposals in the above categories can be found on the website.

Key Dates

  • Paper Submission Deadline: December 4, 2017
  • Notification of acceptance: February 13, 2018
  • Camera-ready manuscript: March 18, 2018

  

Additional Information

General co-Chairs
Rolf Drechsler
University of Bremen/DFKI Bibliothekstr. 5
28359 Bremen, Germany drechsler@uni-bremen.de

Stephan Eggersglüß
Mentor Graphics Tempowerkring 1 B
21079 Hamburg, Germany stephan_eggersgluess@mentor.com

Program Chair
Bernd Becker
University of Freiburg Georges Köhler Allee 51
79110 Freiburg im Breisgau, Germany becker@informatik.uni-freiburg.de

Committee

General Chairs

  • Stephan Eggersglüß (DE)
  • Rolf Drechsler (DE)

General Vice-Chair

  • Mehdi Tahoori (DE)

Program Chair

  • Bernd Becker (DE)

Program Vice-Chair

  • Haralampos-G. Stratigopoulos (FR)

Topic Chairs

  • Paolo Bernardi (IT),
  • Christoph Scholl (DE),
  • Said Hamdioui (NL),
  • Krish Chakrabarty (US),
  • Patrick Girard (FR),
  • Erik Larsson (SE),
  • Gildas Léger (ES),
  • Michael Maniatakos (AE),
  • Adit Singh (US),
  • Ilia Polian (DE),
  • Jochen Rivoir (DE)

ETS2 Chairs

  • Rene Segers (NL)
  • Zebo Peng (SE)

Panel Chairs

  • Xinli Gu (US)
  • Mehdi Tahoori (DE)

Embedded Tutorial Chairs

  • Teresa McLaurin (US)
  • Maria Michael (CY)

Special Session Chairs

  • Stephen Sunter (CAN)
  • Jerzy Tyszer (PL)

Industrial Relations Chairs

  • Juergen Schloe el (DE)
  • Hans Manhaeve (BE)

Publica on Chairs

  • Giorgio Di Natale (FR)
  • Alberto Bosio (FR)

Web & Electronic Media Chairs

  • Lisa Jungmann (DE)
  • Stefano Di Carlo (IT)

Publicity Chairs

  • Elena Ioana Vatajelu (FR)
  • Michiko Inoue (JP)
  • Ioannis Voyatzis (GR)

Award Chairs

  • Sybille Hellebrand (DE)
  • Peter Maxwell (US)

ETS Fringe Workshops

  • Ilia Polian (DE)
  • Maksim Jenihhin (EE)

Regional Liaisons

  • Shi-Yu Huang (TW)
  • Fernanda Lima Kastensmidt (BR)
  • Adam Osseiran (AUS)
  • Nicola Nicolici (CAN)
  • Ashraf Farghaly Salem (EG)
  • Local & Financial Chair
  • Sebas an Huhn (DE)

TSS (Test Spring School) Chairs

  • Lorena Anghel (FR)
  • Hans-Joachim Wunderlich (DE)

TSS Local Chair

  • Görschwin Fey (DE)

Steering Committee

  • Matteo Sonza Reorda (IT) – Chair
  • Lorena Anghel (FR)
  • Bernd Becker (DE)
  • Rolf Drechsler (DE)
  • Stephan Eggersglüß (DE)
  • Joan Figueras (ES)
  • Patrick Girard (FR)
  • Said Hamdioui (NL)
  • Pete Harrod (UK)
  • Sybille Hellebrand (DE)
  • Hans Manhaeve (BE)
  • Erik Jan Marinissen (BE)
  • Maria K. Michael (CY)
  • Liviu Miclea (RO)
  • Zebo Peng (SE)
  • Michel Renovell (FR)
  • Jochen Rivoir (DE)
  • Hans-Joachim Wunderlich (DE)
  • Yervant Zorian (US)
For more information, visit us on the web at: www.ets18.de

The 23rd IEEE European Test Symposium is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).


IEEE Computer Society-Test Technology Technical Council

TTTC CHAIR
Chen-Huan CHIANG
Intel - USA
E-mail chen-huan.chiang@intel.com

PAST CHAIR
Michael NICOLAIDIS
TIMA laboratory - France
E-mail michael.nicolaidis@imag.fr

TTTC 1ST VICE CHAIR
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

SECRETARY
Joan FIGUERAS
Un. Politec. de Catalunya - Spain
E-mail figueras@eel.upc.es

TEST WEEK COORDINATOR
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

TUTORIALS AND EDUCATION
Paolo BERNARDI

Politecnico di Torino
- Italy
E-mail paolo.bernardi@polito.it

STANDARDS
Rohit KAPUR

Synopsys
, Inc. - USA
E-mail rkapur@synopsys.com

EUROPE
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

MIDDLE EAST & AFRICA
Ibrahim HAJJ
American University of Beirut - Lebanon
E-mail ihajj@aub.edu.lb

STANDING COMMITTEES
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

ELECTRONIC MEDIA
Giorgio DI NATALE
LIRMM - France
E-mail giorgio.dinatale@lirmm.fr

 

PRESIDENT OF BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com

SENIOR PAST CHAIR
Adith SINGH
Auburn University – USA
E-mail adsingh@eng.auburn.edu

TTTC 2ND VICE CHAIR
Rohit KAPUR
Synopsys, Inc. – USA
E-mail rkapur@synopsys.com

FINANCE
Chen-Huan CHIANG
Alcatel-Lucent - USA
E-mail chen-huan.chiang@alcatel-lucent.com

TECHNICAL MEETINGS
Chen-Huan CHIANG
Alcatel-Lucent
- USA
E-mail chenhuan@alcatel-lucent.com

TECHNICAL ACTIVITIES
Matteo SONZA REORDA
Politecnico di Torino - Italy
E-mail matteo.sonzareorda@polito.it

ASIA & PACIFIC
Kazumi HATAYAMA
NAIST - Japan
E-mail k-hatayama@is.naist.jp

LATIN AMERICA
Victor Hugo CHAMPAC
Instituto Nacional de Astrofisica - Mexico
E-mail champac@inaoep.mx

NORTH AMERICA
André IVANOV
University of British Columbia - Canada
E-mail ivanov@ece.ubc.ca

COMMUNICATIONS
Cecilia METRA
Università di Bologna - Italy
E-mail cmetra@deis.unibo.it

INDUSTRY ADVISORY BOARD
Yervant ZORIAN
Synopsys, Inc. - USA
E-mail Yervant.Zorian@synopsys.com


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